The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...

SINGAPORE — ST Assembly Test Services Ltd. this week announced availability of a thinner version of its small-thin plastic ball-grid array (STPBGA) package, which reduces the height to 1.2 mm compared ...

Housed in a 255-contact plastic ball-grid-array package that measures just 25 by 25 mm, the W82M32V-XBX multichip memory module provides up to 2 Mwords by 32 bits of asynchronous static memory. The ...

The prices of PBGA (plastic ball-grid array) substrates rose 10% recently, almost two months earlier than what the market had expected, according to sources at the makers. In addition, production lead ...

Much has changed in IC packaging technology since the first real-time microfocus X-ray systems entered the inspection market nearly 20 years ago. The trend for high-density packaging is moving from ...