Spansion Inc. and United Microelectronics Corporation announced the joint development of a 40nm process that integrates UMC’s 40nm LP logic process with Spansion® proprietary embedded Charge Trap (eCT ...
Santa Cruz, Calif. — Going boldly where no programmable logic has gone before, Actel Corp. is slated this week to unwrap its Fusion Programmable System Chip (PSC), said to be the world's first ...
Advanced Micro Devices Inc. (AMD) plans to develop flash memory chips that blend the best characteristics of the two dominant flash memory architectures, the company announced. AMD’s Ornand chips are ...
Some digital design and verification engineers imagine that their colleagues working on analog/mixed-signal (AMS) chips are jealous. After all, the digital development flow has enjoyed the benefits of ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
Check out more coverage of the 2022 Flash Memory Summit. Micron has started mass production of its most advanced triple-level-cell (TLC) 3D NAND chips made up of 232 layers of memory cells, pulling ...
In the world of flash memory, two primary types dominate the market: NOR flash and NAND flash. While they both serve as essential components in various electronic devices, they differ significantly in ...
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